Bhubaneswar: Odisha has taken a significant step towards emerging as India’s next powerhouse in semiconductors and advanced electronics. Chief Minister Mohan Charan Majhi attended SEMICON India 2025 in New Delhi, where he showcased the state’s vision for the industry.
During the event, CM Majhi inaugurated the Odisha Pavilion and signed MoUs worth ₹2,655 crore with TopTrack Hi-Tech PCB Pvt. Ltd. (₹1,005 crore) and Sancode Technologies Ltd (₹1,650 crore). These partnerships aim to position Odisha as a preferred global destination for the semiconductor and advanced electronics industry.
The Chief Minister also engaged with global majors like Intel, Micron, Western Digital, Renesas, and Siemens, highlighting the state’s potential for innovation and investment.
Odisha’s landmark projects under the India Semiconductor Mission, along with the Odisha Semiconductor Manufacturing & Fabless Policy 2025 and the Electronics Component Manufacturing (ECM) Policy 2025, demonstrate the state’s commitment to building a world-class ecosystem for semiconductors and electronics.
Notably, CM Majhi met with the leadership of RIR Power Electronics, which is set to launch SiC wafer fabrication in Odisha by December 2025. The company is also expected to start packaging dry runs by March 2026. Additionally, SiCSem Private Limited is expected to break ground for its plant in Odisha in mid-October 2025, further strengthening India’s chip manufacturing ecosystem.
