Bhubaneswar: Odisha took a major step towards strengthening its presence in the semiconductor sector on Sunday, as Chief Minister Mohan Charan Majhi and Union Minister for Electronics & IT and Railways Ashwini Vaishnaw laid the foundation stone for a Rs 2,000-crore 3D glass substrate packaging unit in Infovally, Khordha.
The project, being set up by 3D Glass Solutions, is expected to generate around 2,500 jobs and position the state as an emerging hub for advanced semiconductor manufacturing in the country.
Addressing the gathering, Vaishnaw said the facility would mark the beginning of a new era of industrial and technological growth in Odisha. He noted that the unit would manufacture advanced glass substrate packaging components for the first time in India, adding that the technology represents the future of the global semiconductor industry.
Chief Minister Majhi described the project as a landmark moment for both Odisha and India’s technological ambitions. He said the upcoming unit would be the country’s first advanced 3D glass substrate packaging facility and would cater to emerging sectors such as artificial intelligence, high-performance computing, and defence electronics.
Highlighting Odisha’s growing appeal among global investors, Majhi said that leading multinational companies such as Intel, Lockheed Martin, and Applied Materials are associated with the project, reflecting increasing confidence in the state’s industrial ecosystem.
He added that Odisha has already attracted over Rs 10,000 crore in semiconductor-related investments, and companies like RIR Power Electronics and SiCSEM have already set up units in the state.
“Odisha will play a key role in the vision of a self-reliant India envisioned by the Prime Minister Narendra Modi, and it will serve as the launchpad for self-reliant India in Eastern India,” Majhi said.
The Chief Minister said that the state’s five strengths—including abundant natural resources, robust infrastructure, a skilled workforce, strong connectivity, and responsive governance—have made it a preferred investment destination. Addressing the youth, he described this as a golden opportunity for students and engineers in Odisha and urged them to build their skills and move forward in this emerging sector. He said that Odisha has emerged as an ideal destination for the global semiconductor industry.
“We have the resources, the talent, the infrastructure, and the vision. We want to build the next technology. ‘Odisha is your destination’,” Majhi urged.
He concluded by stating that Odisha has emerged as an ideal destination for the global semiconductor industry. “We have the resources, the talent, the infrastructure, and the vision. We want to build the next generation of technology—Odisha is your destination,” he said.
Officials said the facility, once operational, will produce 70,000 glass panels, 50 million assembled units, and 13,200 advanced 3DHI modules annually.
The event was attended by State Electronics & Information Technology Minister Dr Mukesh Mahaling, Chief Secretary Anu Garg, Additional Chief Secretary of the State Electronics & IT Department Vishal Kumar Dev, Additional Secretary of the Central Electronics & IT Department Amitesh Kumar Sinha, President and CEO of 3D Glass Solutions Babu Mandava, and several other dignitaries.
