Bhubaneswar: Odisha is set to enter the advanced semiconductor manufacturing space with the ground-breaking of India’s first glass substrate-based chip packaging facility on Sunday, with Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw scheduled to attend the ceremony.
According to official sources, the two leaders will unveil the foundation plaque and formally launch the heterogeneous integration packaging solutions project, which will deploy cutting-edge 3D glass-based semiconductor packaging technology.
Described as a major milestone for the country’s electronics ecosystem, the facility will be India’s first to use glass substrate technology for advanced chip packaging. The project, cleared by the Centre with an estimated investment of around ₹1,943 crore, is expected to position Odisha as a key hub in next-generation semiconductor innovation.
Officials said the unit will manufacture advanced 3D heterogeneous integration modules, catering to high-growth sectors such as aerospace, defence, artificial intelligence, 5G communications and data centres.
The project is also expected to generate around 2,500 direct and indirect employment opportunities. Once operational, the facility will have an annual production capacity of nearly 50 million assembled semiconductor units.
The initiative comes amid India’s broader push to strengthen domestic semiconductor capabilities and reduce reliance on imports, while building a globally competitive electronics manufacturing ecosystem.
